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Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

RS Stock No.: 127-041Brand: BergquistManufacturers Part No.: HF225FAC-0.004-AC-1112
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Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

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Stock information temporarily unavailable.

BD 24.244

BD 24.244 Each (Exc. Vat)

BD 26.668

BD 26.668 Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

1

Available in multiples of 1
1BD 24.244
2BD 48.489
3BD 72.734
4BD 96.978
5BD 121.222
6BD 145.467
7BD 169.712
8BD 193.956
9BD 218.200
10BD 242.445
11BD 266.690
12BD 290.934
13BD 315.178
14BD 339.423
15BD 363.668

BD 24.244

BD 24.244 Each (Exc. Vat)

BD 26.668

BD 26.668 Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Stock information temporarily unavailable.

1

Available in multiples of 1
1BD 24.244
2BD 48.489
3BD 72.734
4BD 96.978
5BD 121.222
6BD 145.467
7BD 169.712
8BD 193.956
9BD 218.200
10BD 242.445
11BD 266.690
12BD 290.934
13BD 315.178
14BD 339.423
15BD 363.668

Stock information temporarily unavailable.

Please check again later.

quantityUnit price
1 - 49BD 24.244
50 - 99BD 23.394
100 - 249BD 22.932
250 - 499BD 22.528
500+BD 22.144
You may be interested in

Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

You may be interested in