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CIF 190 x 290mm Reflow Oven With 10 Programs

RS Stock No.: 130-0859Brand: CIFManufacturers Part No.: V900320
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View all in Reflow Ovens

Technical Document

Specifications

Brand

CIF

Useful Reflow Surface

190 x 290mm

Program Memory Size

10

Maximum Operating Temperature

+300°C

Supply Voltage

230V ac

Product details

Forced Convection Reflow Oven FT03

The FT03 oven is compatible with high temperature alloys and above all "lead free" ones thanks to its new heating system and its electronics. This reflow oven has been concieved to the reflow of solder paste and polymerization of the glues for prototyping.
Includes 10 program memorization, information display on the LCD monitor and a viewing window to supervise the process.

Features

Compact model, but working area of 190 x 290 mm
Heating through forced convection
Temperature control by microprocessor, max. T° 300°C
View of the card thanks to a large window on the front panel
Easy programming for immediate control
Safety: double window with air circulation, closing door access

PCB Assembly Equipment

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BD 1,463.435

Each (Exc. Vat)

BD 1,609.779

Each (inc. VAT)

CIF 190 x 290mm Reflow Oven With 10 Programs

1

Available in multiples of 1
1BD 1,463.435
2BD 2,926.870
3BD 4,390.305
4BD 5,853.740
5BD 7,317.175
6BD 8,780.610
7BD 10,244.045
8BD 11,707.480
9BD 13,170.915
10BD 14,634.350
11BD 16,097.785
12BD 17,561.220
13BD 19,024.655
14BD 20,488.090
15BD 21,951.525

BD 1,463.435

Each (Exc. Vat)

BD 1,609.779

Each (inc. VAT)

CIF 190 x 290mm Reflow Oven With 10 Programs
Stock information temporarily unavailable.

1

Available in multiples of 1
1BD 1,463.435
2BD 2,926.870
3BD 4,390.305
4BD 5,853.740
5BD 7,317.175
6BD 8,780.610
7BD 10,244.045
8BD 11,707.480
9BD 13,170.915
10BD 14,634.350
11BD 16,097.785
12BD 17,561.220
13BD 19,024.655
14BD 20,488.090
15BD 21,951.525
You may be interested in

Technical Document

Specifications

Brand

CIF

Useful Reflow Surface

190 x 290mm

Program Memory Size

10

Maximum Operating Temperature

+300°C

Supply Voltage

230V ac

Product details

Forced Convection Reflow Oven FT03

The FT03 oven is compatible with high temperature alloys and above all "lead free" ones thanks to its new heating system and its electronics. This reflow oven has been concieved to the reflow of solder paste and polymerization of the glues for prototyping.
Includes 10 program memorization, information display on the LCD monitor and a viewing window to supervise the process.

Features

Compact model, but working area of 190 x 290 mm
Heating through forced convection
Temperature control by microprocessor, max. T° 300°C
View of the card thanks to a large window on the front panel
Easy programming for immediate control
Safety: double window with air circulation, closing door access

PCB Assembly Equipment

You may be interested in