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Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil

RS Stock No.: 674-4756Brand: Fischer ElektronikManufacturers Part No.: ICK BGA 14x14x10
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Technical Document

Specifications

For Use With

Universal Square Alu

Length

14mm

Width

14mm

Height

10mm

Dimensions

14 x 14 x 10mm

Thermal Resistance

27.4K/W

Mounting

Adhesive Foil, Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

Country of Origin

Germany

Product details

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).


Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

BGA Heatsinks

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BD 0.810

Each (Exc. Vat)

BD 0.891

Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil

BD 0.810

Each (Exc. Vat)

BD 0.891

Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil
Stock information temporarily unavailable.

Buy in bulk

quantityUnit price
1 - 9BD 0.810
10 - 24BD 0.740
25 - 49BD 0.715
50 - 99BD 0.705
100+BD 0.655

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more
You may be interested in

Technical Document

Specifications

For Use With

Universal Square Alu

Length

14mm

Width

14mm

Height

10mm

Dimensions

14 x 14 x 10mm

Thermal Resistance

27.4K/W

Mounting

Adhesive Foil, Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

Country of Origin

Germany

Product details

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).


Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

BGA Heatsinks

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more
You may be interested in