Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Number of Words
128M
Minimum Operating Temperature
-40 °C
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BD 1.145
Each (In a Pack of 5) (Exc. Vat)
BD 1.259
Each (In a Pack of 5) (Including VAT)
5
BD 1.145
Each (In a Pack of 5) (Exc. Vat)
BD 1.259
Each (In a Pack of 5) (Including VAT)
5
Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Number of Words
128M
Minimum Operating Temperature
-40 °C