Technical Document
Specifications
Brand
WinbondMemory Size
128Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
8
Organisation
16M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W25Q
Number of Words
16M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
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BD 0.790
Each (Supplied in a Tube) (Exc. Vat)
BD 0.869
Each (Supplied in a Tube) (inc. VAT)
Production pack (Tube)
10
BD 0.790
Each (Supplied in a Tube) (Exc. Vat)
BD 0.869
Each (Supplied in a Tube) (inc. VAT)
Production pack (Tube)
10
Technical Document
Specifications
Brand
WinbondMemory Size
128Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
8
Organisation
16M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W25Q
Number of Words
16M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns