Technical Document
Specifications
Brand
WinbondMemory Size
256Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
32M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
10.49mm
Height
2.34mm
Width
7.59mm
Dimensions
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
Series
W25Q
Number of Words
32M
Minimum Operating Temperature
-40 °C
Stock information temporarily unavailable.
Please check again later.
BD 1.460
Each (In a Tube of 44) (Exc. Vat)
BD 1.606
Each (In a Tube of 44) (inc. VAT)
44
BD 1.460
Each (In a Tube of 44) (Exc. Vat)
BD 1.606
Each (In a Tube of 44) (inc. VAT)
44
Technical Document
Specifications
Brand
WinbondMemory Size
256Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
16
Organisation
32M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
10.49mm
Height
2.34mm
Width
7.59mm
Dimensions
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
Series
W25Q
Number of Words
32M
Minimum Operating Temperature
-40 °C