Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Technical Document
Specifications
Brand
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Country of Origin
United States
Product details
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad
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BD 1.205
Each (In a Bag of 50) (Exc. Vat)
BD 1.325
Each (In a Bag of 50) (Including VAT)
50
BD 1.205
Each (In a Bag of 50) (Exc. Vat)
BD 1.325
Each (In a Bag of 50) (Including VAT)
50
Buy in bulk
| quantity | Unit price | Per Bag |
|---|---|---|
| 50 - 450 | BD 1.205 | BD 60.250 |
| 500 - 1200 | BD 1.160 | BD 58.000 |
| 1250 - 2450 | BD 1.125 | BD 56.250 |
| 2500 - 4950 | BD 1.085 | BD 54.250 |
| 5000+ | BD 1.055 | BD 52.750 |
Technical Document
Specifications
Brand
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
Country of Origin
United States
Product details
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad