MBO Paste Lead Free Solder, 217°C Melting Point
Technical Document
Specifications
Brand
MBOModel Number
SIRIUS 1 LF
Percent Lead
0%
Product Form
Paste
Melting Point
217°C
Percent Silver
3%
Percent Tin
96.5%
Flux Type
Rosin
Product Weight
500g
Flux Content Percent
11.5%
Percent Copper
0.5%
Country of Origin
France
Product details
Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5
No-Clean solder paste suitable for stencil printing for reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.
Solder Paste - Lead Free
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Technical Document
Specifications
Brand
MBOModel Number
SIRIUS 1 LF
Percent Lead
0%
Product Form
Paste
Melting Point
217°C
Percent Silver
3%
Percent Tin
96.5%
Flux Type
Rosin
Product Weight
500g
Flux Content Percent
11.5%
Percent Copper
0.5%
Country of Origin
France
Product details
Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5
No-Clean solder paste suitable for stencil printing for reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.