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331041402053, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.1mm x 2mm x 5.3mm

RS Stock No.: 773-4242Brand: Wurth ElektronikManufacturers Part No.: 331041402053
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Technical Document

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

5.3mm

Length

4.1mm

Width_SC_PC

2mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability

Stock information temporarily unavailable.

BD 2.970

BD 0.594 Each (In a Bag of 5) (Exc. Vat)

BD 3.267

BD 0.653 Each (In a Bag of 5) (inc. VAT)

331041402053, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.1mm x 2mm x 5.3mm
Select packaging type

BD 2.970

BD 0.594 Each (In a Bag of 5) (Exc. Vat)

BD 3.267

BD 0.653 Each (In a Bag of 5) (inc. VAT)

331041402053, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 4.1mm x 2mm x 5.3mm
Stock information temporarily unavailable.
Select packaging type

Stock information temporarily unavailable.

Please check again later.

quantityUnit pricePer Bag
5 - 20BD 0.594BD 2.970
25 - 45BD 0.572BD 2.860
50 - 95BD 0.528BD 2.640
100 - 245BD 0.512BD 2.558
250+BD 0.495BD 2.475

Technical Document

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

5.3mm

Length

4.1mm

Width_SC_PC

2mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability