Molex MicroClasp Series Right Angle Through Hole PCB Header, 10 Contact(s), 2.0mm Pitch, 2 Row(s), Shrouded
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
10
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55959
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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BD 4.290
BD 0.429 Each (In a Pack of 10) (Exc. Vat)
BD 4.719
BD 0.472 Each (In a Pack of 10) (inc. VAT)
Standard
10
BD 4.290
BD 0.429 Each (In a Pack of 10) (Exc. Vat)
BD 4.719
BD 0.472 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
Standard
10
Stock information temporarily unavailable.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 240 | BD 0.429 | BD 4.290 |
| 250 - 990 | BD 0.358 | BD 3.575 |
| 1000 - 4990 | BD 0.292 | BD 2.915 |
| 5000 - 9990 | BD 0.280 | BD 2.805 |
| 10000+ | BD 0.275 | BD 2.750 |
Ideate. Create. Collaborate
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Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
10
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Series Number
55959
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Double Row Right Angle Header
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products