Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
BD 7.245
BD 0.724 Each (In a Pack of 10) (Exc. Vat)
BD 7.969
BD 0.796 Each (In a Pack of 10) (inc. VAT)
10
BD 7.245
BD 0.724 Each (In a Pack of 10) (Exc. Vat)
BD 7.969
BD 0.796 Each (In a Pack of 10) (inc. VAT)
10
Stock information temporarily unavailable.
Please check again later.
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | BD 0.724 | BD 7.245 |
| 50 - 240 | BD 0.656 | BD 6.562 |
| 250 - 490 | BD 0.588 | BD 5.880 |
| 500 - 990 | BD 0.546 | BD 5.460 |
| 1000+ | BD 0.530 | BD 5.302 |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor