KYOCERA AVX 33pF Multilayer Ceramic Capacitor MLCC, 200V dc V, ±5% , Through Hole

RS Stock No.: 537-3640Brand: KYOCERA AVXManufacturers Part No.: SR152A330JAR
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Technical Document

Specifications

Lead Spacing

2.5mm

Dielectric

C0G

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+125°C

Terminal Type

Through Hole

Mounting Type

Through Hole

Tolerance

±5%

Length

3.81mm

Depth

2.54mm

Height

3.81mm

Voltage

200V dc

Capacitance

33pF

Dimensions

3.81 x 2.54 x 3.81mm

Series

SR

Product details

ModICE® Enclosures

Ideal for designs in the commercial vehicle market where mounting areas on a vehicle are exposed to harsh environments. Available in 3 sizes LE (large), ME (Mini) and SE (Small).

Features and Benefits

• Snap-fit design
• Heatsink and vented options
• Housings – Glass filled polymer
• Pins – Brass – Post tin plated
• Seals – Silicone elastomer

Available in this range:
581 01 30 043 SE with no heatsinks- 664-7220
581 01 60 033 LE with no heatsinks – 664-7236
581 01 60 039 LE with no heatsinks and membrane vent – 885-7071
581 01 30 059 SE with no heatsinks and membrane vent – 885-7078

PCB – Board Size (approximately)
ME – 4.08 x 3.35" (103 x 85 mm)
SE – 4.50 x 4.60" (114 x 117 mm)
LE – 6.00 x 6.10" (152 x 155 mm)

Modular Integrated Connector Enclosure

Cinch's Modular Integrated Connector Enclosures offer high quality sealed packaging solutions for rugged electronic control module applications. The ModICE product line consists of two distinct enclosure sizes and 6 header configurations allowing 18, 30, 48 and 60 I/O mating to Cinch's SHS harness connectors.

Stock information temporarily unavailable.

Please check again later.

Stock information temporarily unavailable.

BD 0.135

Each (In a Pack of 25) (Exc. Vat)

BD 0.149

Each (In a Pack of 25) (Including VAT)

KYOCERA AVX 33pF Multilayer Ceramic Capacitor MLCC, 200V dc V, ±5% , Through Hole
Select packaging type

BD 0.135

Each (In a Pack of 25) (Exc. Vat)

BD 0.149

Each (In a Pack of 25) (Including VAT)

KYOCERA AVX 33pF Multilayer Ceramic Capacitor MLCC, 200V dc V, ±5% , Through Hole
Stock information temporarily unavailable.
Select packaging type

Buy in bulk

quantityUnit pricePer Pack
25 - 225BD 0.135BD 3.375
250 - 1225BD 0.105BD 2.625
1250+BD 0.090BD 2.250

Technical Document

Specifications

Lead Spacing

2.5mm

Dielectric

C0G

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+125°C

Terminal Type

Through Hole

Mounting Type

Through Hole

Tolerance

±5%

Length

3.81mm

Depth

2.54mm

Height

3.81mm

Voltage

200V dc

Capacitance

33pF

Dimensions

3.81 x 2.54 x 3.81mm

Series

SR

Product details

ModICE® Enclosures

Ideal for designs in the commercial vehicle market where mounting areas on a vehicle are exposed to harsh environments. Available in 3 sizes LE (large), ME (Mini) and SE (Small).

Features and Benefits

• Snap-fit design
• Heatsink and vented options
• Housings – Glass filled polymer
• Pins – Brass – Post tin plated
• Seals – Silicone elastomer

Available in this range:
581 01 30 043 SE with no heatsinks- 664-7220
581 01 60 033 LE with no heatsinks – 664-7236
581 01 60 039 LE with no heatsinks and membrane vent – 885-7071
581 01 30 059 SE with no heatsinks and membrane vent – 885-7078

PCB – Board Size (approximately)
ME – 4.08 x 3.35" (103 x 85 mm)
SE – 4.50 x 4.60" (114 x 117 mm)
LE – 6.00 x 6.10" (152 x 155 mm)

Modular Integrated Connector Enclosure

Cinch's Modular Integrated Connector Enclosures offer high quality sealed packaging solutions for rugged electronic control module applications. The ModICE product line consists of two distinct enclosure sizes and 6 header configurations allowing 18, 30, 48 and 60 I/O mating to Cinch's SHS harness connectors.