Technical Document
Specifications
Brand
TDKInductance
22 μH
Maximum dc Current
330mA
Package/Case
2010 (5025M)
Length
2mm
Depth
1.6mm
Height
0.95mm
Dimensions
2 x 1.6 x 0.95mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
2.04Ω
Series
VLS-E
Core Material
Ferrite
Maximum Self Resonant Frequency
1MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS2010E Series Magnetically Shielded Wire Wound Inductors
VLS2010E Series have a high magnetic shield construction and compatible with high-density mounting
Low-profile product line-up with maximum heights of 0.8mm, 0.95mm, 1.0mm, 1.2mm, and 1.5mm allowing for different usages
Applications in Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules
TDK Non Standard SMT Inductors (Chokes)
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Please check again later.
BD 0.110
Each (In a Bag of 10) (Exc. Vat)
BD 0.121
Each (In a Bag of 10) (inc. VAT)
10
BD 0.110
Each (In a Bag of 10) (Exc. Vat)
BD 0.121
Each (In a Bag of 10) (inc. VAT)
10
Buy in bulk
quantity | Unit price | Per Bag |
---|---|---|
10 - 40 | BD 0.110 | BD 1.100 |
50 - 90 | BD 0.105 | BD 1.050 |
100 - 190 | BD 0.100 | BD 1.000 |
200 - 490 | BD 0.095 | BD 0.950 |
500+ | BD 0.090 | BD 0.900 |
Technical Document
Specifications
Brand
TDKInductance
22 μH
Maximum dc Current
330mA
Package/Case
2010 (5025M)
Length
2mm
Depth
1.6mm
Height
0.95mm
Dimensions
2 x 1.6 x 0.95mm
Shielded
Yes
Tolerance
±20%
Maximum DC Resistance
2.04Ω
Series
VLS-E
Core Material
Ferrite
Maximum Self Resonant Frequency
1MHz
Inductor Construction
Wire-Wound
Maximum Operating Temperature
+105°C
Minimum Operating Temperature
-40°C
Product details
VLS2010E Series Magnetically Shielded Wire Wound Inductors
VLS2010E Series have a high magnetic shield construction and compatible with high-density mounting
Low-profile product line-up with maximum heights of 0.8mm, 0.95mm, 1.0mm, 1.2mm, and 1.5mm allowing for different usages
Applications in Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices and compact power supply modules