Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
BD 8.305
BD 0.830 Each (In a Pack of 10) (Exc. Vat)
BD 9.135
BD 0.913 Each (In a Pack of 10) (inc. VAT)
10
BD 8.305
BD 0.830 Each (In a Pack of 10) (Exc. Vat)
BD 9.135
BD 0.913 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
10
Stock information temporarily unavailable.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | BD 0.830 | BD 8.305 |
| 50 - 240 | BD 0.748 | BD 7.480 |
| 250 - 490 | BD 0.671 | BD 6.710 |
| 500 - 990 | BD 0.622 | BD 6.215 |
| 1000+ | BD 0.605 | BD 6.050 |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor