Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

RS Stock No.: 127-041Brand: BergquistManufacturers Part No.: HF225FAC-0.004-AC-1112
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Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

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BD 22.650

Each (Exc. Vat)

BD 24.915

Each (Including VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

1

Available in multiples of 1
1BD 22.650
2BD 45.300
3BD 67.950
4BD 90.600
5BD 113.250
6BD 135.900
7BD 158.550
8BD 181.200
9BD 203.850
10BD 226.500
11BD 249.150
12BD 271.800
13BD 294.450
14BD 317.100
15BD 339.750

BD 22.650

Each (Exc. Vat)

BD 24.915

Each (Including VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Stock information temporarily unavailable.

1

Available in multiples of 1
1BD 22.650
2BD 45.300
3BD 67.950
4BD 90.600
5BD 113.250
6BD 135.900
7BD 158.550
8BD 181.200
9BD 203.850
10BD 226.500
11BD 249.150
12BD 271.800
13BD 294.450
14BD 317.100
15BD 339.750

Buy in bulk

quantityUnit price
1 - 49BD 22.650
50 - 99BD 21.855
100 - 249BD 21.115
250 - 499BD 20.440
500+BD 20.095

Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm