Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

RS Stock No.: 752-4897Brand: BergquistManufacturers Part No.: HF650P-0.001-01-00-43
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Technical Document

Specifications

Brand

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

PRICED TO CLEAR

Yes

Country of Origin

United States

Product details

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad

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BD 0.180

Each (In a Bag of 50) (Exc. Vat)

BD 0.198

Each (In a Bag of 50) (Including VAT)

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

50

Available in multiples of 50
50BD 9.000
100BD 18.000
150BD 27.000
200BD 36.000
250BD 45.000
300BD 54.000
350BD 63.000
400BD 72.000
450BD 81.000
500BD 90.000
550BD 99.000
600BD 108.000
650BD 117.000
700BD 126.000
750BD 135.000

BD 0.180

Each (In a Bag of 50) (Exc. Vat)

BD 0.198

Each (In a Bag of 50) (Including VAT)

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Stock information temporarily unavailable.

50

Available in multiples of 50
50BD 9.000
100BD 18.000
150BD 27.000
200BD 36.000
250BD 45.000
300BD 54.000
350BD 63.000
400BD 72.000
450BD 81.000
500BD 90.000
550BD 99.000
600BD 108.000
650BD 117.000
700BD 126.000
750BD 135.000

Technical Document

Specifications

Brand

Bergquist

Thickness

0.001in

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+150°C

Material Trade Name

Hi-Flow 650P

Operating Temperature Range

-40 → +150 °C

PRICED TO CLEAR

Yes

Country of Origin

United States

Product details

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad