Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
BD 33.314
BD 33.314 Each (Exc. Vat)
BD 36.645
BD 36.645 Each (inc. VAT)
1
BD 33.314
BD 33.314 Each (Exc. Vat)
BD 36.645
BD 36.645 Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
Quantity | Unit price |
---|---|
1 - 9 | BD 33.314 |
10 - 19 | BD 31.982 |
20 - 49 | BD 31.372 |
50+ | BD 29.156 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips