Chemtronics 3m No Clean Desoldering Braid, Width 1.5mm
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
BD 3.367
BD 3.367 Each (Exc. Vat)
BD 3.704
BD 3.704 Each (inc. VAT)
1
BD 3.367
BD 3.367 Each (Exc. Vat)
BD 3.704
BD 3.704 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | BD 3.367 |
| 10 - 19 | BD 3.232 |
| 20 - 49 | BD 3.130 |
| 50+ | BD 2.859 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid