Chemtronics 1.5 m No Clean De-Soldering Braid, Width 2.8 mm
Technical Document
Specifications
Brand
ChemtronicsProduct Type
De-Soldering Braid
Width
2.8 mm
Length
1.5m
No Clean
Yes
Country of Origin
United States
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
BD 24.611
BD 24.611 Each (Exc. Vat)
BD 27.072
BD 27.072 Each (inc. VAT)
1
BD 24.611
BD 24.611 Each (Exc. Vat)
BD 27.072
BD 27.072 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | BD 24.611 |
| 10 - 19 | BD 23.629 |
| 20 - 49 | BD 23.016 |
| 50+ | BD 21.421 |
Technical Document
Specifications
Brand
ChemtronicsProduct Type
De-Soldering Braid
Width
2.8 mm
Length
1.5m
No Clean
Yes
Country of Origin
United States
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid