Chemtronics 1.5m No Clean Desoldering Braid, Width 2.8mm
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
BD 21.520
BD 21.520 Each (Exc. Vat)
BD 23.672
BD 23.672 Each (inc. VAT)
1
BD 21.520
BD 21.520 Each (Exc. Vat)
BD 23.672
BD 23.672 Each (inc. VAT)
1
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Please check again later.
| quantity | Unit price |
|---|---|
| 1 - 9 | BD 21.520 |
| 10 - 19 | BD 20.800 |
| 20 - 49 | BD 20.470 |
| 50+ | BD 19.036 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid