JST Crimp Extraction Tool, YC Series, Crimp Contact, Extraction Tool Contact

RS Stock No.: 688-0871Brand: JSTManufacturers Part No.: EJ-PHD
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View all in Insertion & Extraction Tools

Technical Document

Specifications

Brand

JST

Contact Type

Crimp

Product Type

Crimp Extraction Tool

Sub Type

Extraction Tool

Series

YC

For Use With

SPHD Connectors

Standards/Approvals

No

Product details

PHD Series Tooling

,

688-0871 Extraction tool for PHD Series contacts

2.0mm Wire to Board JST - PHD Series

The PHD Series is a 2.0mm (.079") pitch, crimp style, double-row, Wire-to-Board connector. It is designed to meet the demand for high density and low-profile connection.

View all in Insertion & Extraction Tools

Stock information temporarily unavailable.

BD 38.362

BD 38.362 Each (Exc. Vat)

BD 42.198

BD 42.198 Each (inc. VAT)

JST Crimp Extraction Tool, YC Series, Crimp Contact, Extraction Tool Contact

1

Available in multiples of 1
1BD 38.362
2BD 76.724
3BD 115.086
4BD 153.447
5BD 186.058
6BD 223.270
7BD 260.481
8BD 297.693
9BD 334.905
10BD 372.116
11BD 409.328
12BD 446.540
13BD 483.751
14BD 520.963
15BD 558.175

BD 38.362

BD 38.362 Each (Exc. Vat)

BD 42.198

BD 42.198 Each (inc. VAT)

JST Crimp Extraction Tool, YC Series, Crimp Contact, Extraction Tool Contact

Stock information temporarily unavailable.

1

Available in multiples of 1
1BD 38.362
2BD 76.724
3BD 115.086
4BD 153.447
5BD 186.058
6BD 223.270
7BD 260.481
8BD 297.693
9BD 334.905
10BD 372.116
11BD 409.328
12BD 446.540
13BD 483.751
14BD 520.963
15BD 558.175

QuantityUnit price
1 - 4BD 38.362
5+BD 37.212

Technical Document

Specifications

Brand

JST

Contact Type

Crimp

Product Type

Crimp Extraction Tool

Sub Type

Extraction Tool

Series

YC

For Use With

SPHD Connectors

Standards/Approvals

No

Product details

PHD Series Tooling

,

688-0871 Extraction tool for PHD Series contacts

2.0mm Wire to Board JST - PHD Series

The PHD Series is a 2.0mm (.079") pitch, crimp style, double-row, Wire-to-Board connector. It is designed to meet the demand for high density and low-profile connection.