Malico 29mm
Technical Document
Specifications
Product details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks
Stock information temporarily unavailable.
BD 3.867
BD 3.867 Each (Exc. Vat)
BD 4.254
BD 4.254 Each (inc. VAT)
1
BD 3.867
BD 3.867 Each (Exc. Vat)
BD 4.254
BD 4.254 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | BD 3.867 |
| 10 - 24 | BD 3.560 |
| 25 - 49 | BD 3.404 |
| 50 - 99 | BD 3.283 |
| 100+ | BD 3.017 |
Technical Document
Specifications
Product details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks