
Technical Documents
Specifications
Brand
MolexProduct Type
PCB Header
Series
MicroClasp
Pitch
2mm
Current
3A
Number of Contacts
3
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Tin
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
2mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Mating Pin Length
2mm
Standards/Approvals
No
Voltage
250V
Country of Origin
Japan
Product Details
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The Terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a Compact 2.00mm pitch design.
UL 94V-0
Stock information temporarily unavailable.
BD 2.023
BD 0.202 Each (In a Pack of 10) (Exc. Vat)
BD 2.225
BD 0.222 Each (In a Pack of 10) (inc. VAT)
Standard
10
BD 2.023
BD 0.202 Each (In a Pack of 10) (Exc. Vat)
BD 2.225
BD 0.222 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
Standard
10
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 190 | BD 0.202 | BD 2.023 |
| 200 - 740 | BD 0.197 | BD 1.965 |
| 750 - 2990 | BD 0.197 | BD 1.965 |
| 3000 - 5990 | BD 0.191 | BD 1.907 |
| 6000+ | BD 0.191 | BD 1.907 |
Technical Documents
Specifications
Brand
MolexProduct Type
PCB Header
Series
MicroClasp
Pitch
2mm
Current
3A
Number of Contacts
3
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Tin
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
2mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Mating Pin Length
2mm
Standards/Approvals
No
Voltage
250V
Country of Origin
Japan
Product Details
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The Terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a Compact 2.00mm pitch design.
UL 94V-0