Molex MicroClasp Series Right Angle Through Hole PCB Header, 15 Contact(s), 2.0mm Pitch, 1 Row(s), Shrouded
Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
15
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
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Stock information temporarily unavailable.
BD 5.318
BD 0.532 Each (In a Pack of 10) (Exc. Vat)
BD 5.850
BD 0.585 Each (In a Pack of 10) (inc. VAT)
Standard
10
BD 5.318
BD 0.532 Each (In a Pack of 10) (Exc. Vat)
BD 5.850
BD 0.585 Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
Standard
10
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | BD 0.532 | BD 5.318 |
| 50 - 90 | BD 0.509 | BD 5.086 |
| 100 - 490 | BD 0.480 | BD 4.797 |
| 500+ | BD 0.451 | BD 4.508 |
Ideate. Create. Collaborate
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Technical Document
Specifications
Brand
MolexSeries
MICROCLASP
Pitch
2.0mm
Number Of Contacts
15
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Series Number
55935
Current Rating
3.0A
Voltage Rating
250.0 V
Country of Origin
Japan
Product details
Single Row Right Angle Header with Boss
Approvals
UL 94V-0
2.0mm Wire to Board - Molex MicroClasp™ Range
MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a compact 2.00mm pitch design.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products