Multicore Wire, 1mm Lead Free Solder, 217°C Melting Point
Technical Document
Specifications
Brand
MulticoreWire Diameter
1mm
Model Number
C400
Percent Lead
0%
Product Form
Wire
Melting Point
217°C
Percent Silver
3.8%
Percent Tin
95.5%
Flux Type
Activated Rosin
Product Weight
500g
Flux Content Percent
3%
Percent Copper
0.7%
Country of Origin
Malaysia
Product details
Solder wire Sn95.5 Ag3.5 Cu0.7
96SC Crystal 400 No-Clean solder wire with incorporated flux.
On a spool.
Halide-free.
Constant heat, low spatter.
High speed soldering, range of activities suitable for all applications.
Good spread on copper, brass and nickel.
Clear residue.
Standards
J-STD-004, EN29453.
Stock information temporarily unavailable.
Please check again later.
P.O.A.
1
P.O.A.
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 9 | P.O.A. |
| 10 - 19 | P.O.A. |
| 20 - 49 | P.O.A. |
| 50+ | P.O.A. |
Technical Document
Specifications
Brand
MulticoreWire Diameter
1mm
Model Number
C400
Percent Lead
0%
Product Form
Wire
Melting Point
217°C
Percent Silver
3.8%
Percent Tin
95.5%
Flux Type
Activated Rosin
Product Weight
500g
Flux Content Percent
3%
Percent Copper
0.7%
Country of Origin
Malaysia
Product details
Solder wire Sn95.5 Ag3.5 Cu0.7
96SC Crystal 400 No-Clean solder wire with incorporated flux.
On a spool.
Halide-free.
Constant heat, low spatter.
High speed soldering, range of activities suitable for all applications.
Good spread on copper, brass and nickel.
Clear residue.
Standards
J-STD-004, EN29453.