Technical Document
Specifications
Product details
MP218 No clean Tin-Lead solder paste
No clean solder paste with low wastage qualities.
Halide free flux classification ROL0 to ANSI/J-STD-004
Outstanding humidity resistance
Colourless residue for easy post reflow inspection
Extended open time & tack-life for low wastage
Suitable for fine pitch, high speed printing up to 150mm/s
Particle size 15-45μm
Supplied in 500g tubs
Supplied with
Material Satety Data Sheet.
Standards
ROL0 to ANSI/J-STD-004
Solder Paste - Leaded
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Technical Document
Specifications
Product details
MP218 No clean Tin-Lead solder paste
No clean solder paste with low wastage qualities.
Halide free flux classification ROL0 to ANSI/J-STD-004
Outstanding humidity resistance
Colourless residue for easy post reflow inspection
Extended open time & tack-life for low wastage
Suitable for fine pitch, high speed printing up to 150mm/s
Particle size 15-45μm
Supplied in 500g tubs
Supplied with
Material Satety Data Sheet.
Standards
ROL0 to ANSI/J-STD-004