Technical Document
Specifications
Brand
onsemiPackage Type
ChipFET
Mounting Type
Surface Mount
Maximum Power Dissipation
1.1 W
Pin Count
8
Number of Elements per Chip
2
Maximum Operating Temperature
+150 °C
Dimensions
3.1 x 1.7 x 1.1mm
Country of Origin
Malaysia
BD 610.500
BD 0.204 Each (On a Reel of 3000) (Exc. Vat)
BD 671.550
BD 0.224 Each (On a Reel of 3000) (inc. VAT)
3000
BD 610.500
BD 0.204 Each (On a Reel of 3000) (Exc. Vat)
BD 671.550
BD 0.224 Each (On a Reel of 3000) (inc. VAT)
3000
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Technical Document
Specifications
Brand
onsemiPackage Type
ChipFET
Mounting Type
Surface Mount
Maximum Power Dissipation
1.1 W
Pin Count
8
Number of Elements per Chip
2
Maximum Operating Temperature
+150 °C
Dimensions
3.1 x 1.7 x 1.1mm
Country of Origin
Malaysia


