Technical Document
Specifications
Brand
Renesas ElectronicsFamily Name
RX630
Package Type
LQFP
Mounting Type
Surface Mount
Pin Count
144
Device Core
RX CPU
Data Bus Width
32bit
Program Memory Size
2 kB
Maximum Frequency
100MHz
RAM Size
128 kB
USB Channels
1
Number of SPI Channels
16
Number of CAN Channels
3
Typical Operating Supply Voltage
2.7 → 3.6 V
Number of I2C Channels
17
Number of UART Channels
13
Minimum Operating Temperature
-40 °C
Dimensions
20.1 x 20.1 x 1.4mm
Instruction Set Architecture
CISC Harvard
Width
20.1mm
Height
1.4mm
ADCs
29 x 10/12 bit
Length
20.1mm
Number of ADC Units
2
Program Memory Type
Flash
Maximum Operating Temperature
+85 °C
Stock information temporarily unavailable.
BD 610.368
BD 10.173 Each (In a Tray of 60) (Exc. Vat)
BD 671.405
BD 11.190 Each (In a Tray of 60) (inc. VAT)
60
BD 610.368
BD 10.173 Each (In a Tray of 60) (Exc. Vat)
BD 671.405
BD 11.190 Each (In a Tray of 60) (inc. VAT)
Stock information temporarily unavailable.
60
| Quantity | Unit price | Per Tray |
|---|---|---|
| 60 - 60 | BD 10.173 | BD 610.368 |
| 120 - 240 | BD 9.884 | BD 593.028 |
| 300 - 480 | BD 9.011 | BD 540.661 |
| 540 - 960 | BD 8.433 | BD 505.981 |
| 1020+ | BD 7.722 | BD 463.325 |
Technical Document
Specifications
Brand
Renesas ElectronicsFamily Name
RX630
Package Type
LQFP
Mounting Type
Surface Mount
Pin Count
144
Device Core
RX CPU
Data Bus Width
32bit
Program Memory Size
2 kB
Maximum Frequency
100MHz
RAM Size
128 kB
USB Channels
1
Number of SPI Channels
16
Number of CAN Channels
3
Typical Operating Supply Voltage
2.7 → 3.6 V
Number of I2C Channels
17
Number of UART Channels
13
Minimum Operating Temperature
-40 °C
Dimensions
20.1 x 20.1 x 1.4mm
Instruction Set Architecture
CISC Harvard
Width
20.1mm
Height
1.4mm
ADCs
29 x 10/12 bit
Length
20.1mm
Number of ADC Units
2
Program Memory Type
Flash
Maximum Operating Temperature
+85 °C


