RS PRO Heatsink, Universal Square Alu, 0.39°C/W, 150 x 150 x 25mm, PCB Mount
Technical Document
Specifications
Brand
RS ProFor Use With
Universal Square Alu
Length
150mm
Width
150mm
Height
25mm
Dimensions
150 x 150 x 25mm
Thermal Resistance
0.39°C/W
Mounting
PCB Mount
Series
100
Material
Aluminium
Application
High Power Semiconductor Device, Optoelectronic Device
Finish
Anodized
Country of Origin
United Kingdom
Product details
Heat Sink 113AB Series, 150mm Wide x 25mm High
ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.
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BD 17.980
Each (Exc. Vat)
BD 19.778
Each (inc. VAT)
1
BD 17.980
Each (Exc. Vat)
BD 19.778
Each (inc. VAT)
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 9 | BD 17.980 |
| 10 - 24 | BD 17.020 |
| 25 - 49 | BD 16.635 |
| 50+ | BD 16.380 |
Technical Document
Specifications
Brand
RS ProFor Use With
Universal Square Alu
Length
150mm
Width
150mm
Height
25mm
Dimensions
150 x 150 x 25mm
Thermal Resistance
0.39°C/W
Mounting
PCB Mount
Series
100
Material
Aluminium
Application
High Power Semiconductor Device, Optoelectronic Device
Finish
Anodized
Country of Origin
United Kingdom
Product details
Heat Sink 113AB Series, 150mm Wide x 25mm High
ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.