Rubycon 47μF Aluminium Electrolytic Capacitor 25V dc, Radial, Through Hole - 25ZLG47MEFC6.3X7
Technical Document
Specifications
Dimensions (L x W x H)
94 x 94 x45mm
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+105°C
Leakage Current
0.01 CV or 3 μA
Lead Pitch
2.5mm
Diameter
6.3mm
USB Version
USB2.0
Lifetime
1000h
Tolerance
±20%
Voltage
25V dc
Height
7mm
Capacitance
47µF
Series
ZLG
Dimensions
6.3 (Dia.) x 7mm
Ripple Current
480mA
Brand
RubyconProduct details
TDK C Type 0805 Series C0G, X6S, X7R, X7S, X7T, X8R, Y5V Dielectric
TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.
Features and Benefits:
High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR
Applications:
Commercial Grade for general applications including
General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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BD 0.100
Each (In a Pack of 25) (Exc. Vat)
BD 0.110
Each (In a Pack of 25) (Including VAT)
Standard
25
BD 0.100
Each (In a Pack of 25) (Exc. Vat)
BD 0.110
Each (In a Pack of 25) (Including VAT)
Standard
25
Buy in bulk
| quantity | Unit price | Per Pack |
|---|---|---|
| 25 - 75 | BD 0.100 | BD 2.500 |
| 100 - 225 | BD 0.095 | BD 2.375 |
| 250 - 475 | BD 0.090 | BD 2.250 |
| 500 - 975 | BD 0.085 | BD 2.125 |
| 1000+ | BD 0.080 | BD 2.000 |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
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Technical Document
Specifications
Dimensions (L x W x H)
94 x 94 x45mm
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+105°C
Leakage Current
0.01 CV or 3 μA
Lead Pitch
2.5mm
Diameter
6.3mm
USB Version
USB2.0
Lifetime
1000h
Tolerance
±20%
Voltage
25V dc
Height
7mm
Capacitance
47µF
Series
ZLG
Dimensions
6.3 (Dia.) x 7mm
Ripple Current
480mA
Brand
RubyconProduct details
TDK C Type 0805 Series C0G, X6S, X7R, X7S, X7T, X8R, Y5V Dielectric
TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.
Features and Benefits:
High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR
Applications:
Commercial Grade for general applications including
General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products