Technical Documents
Specifications
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Sub Type
Open Pin Field Array
Number of Rows
8
Pitch
1.27mm
Current
2.2A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
250V
Series
LPAM
Row Pitch
1.27mm
Contact Material
Copper Alloy
Contact Plating
Gold
Standards/Approvals
RoHS
Product Details
The Samtec 1.27 LP Array high-speed, high-density low profile open-pin-field array has 320 position with 6 rows. It used black LCP of insulating material.
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Stock information temporarily unavailable.
BD 4,931.850
BD 16.440 Each (On a Reel of 300) (Exc. Vat)
BD 5,425.035
BD 18.084 Each (On a Reel of 300) (inc. VAT)
300
BD 4,931.850
BD 16.440 Each (On a Reel of 300) (Exc. Vat)
BD 5,425.035
BD 18.084 Each (On a Reel of 300) (inc. VAT)
Stock information temporarily unavailable.
300
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
Technical Documents
Specifications
Brand
SamtecNumber of Contacts
320
Product Type
PCB Socket
Sub Type
Open Pin Field Array
Number of Rows
8
Pitch
1.27mm
Current
2.2A
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
Surface
Orientation
Straight
Connector System
Board-to-Board
Voltage
250V
Series
LPAM
Row Pitch
1.27mm
Contact Material
Copper Alloy
Contact Plating
Gold
Standards/Approvals
RoHS
Product Details
The Samtec 1.27 LP Array high-speed, high-density low profile open-pin-field array has 320 position with 6 rows. It used black LCP of insulating material.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
