Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
PNP
Maximum DC Collector Current
-3 A
Maximum Collector Emitter Voltage
-45 V
Package Type
SOT-32
Mounting Type
Through Hole
Maximum Power Dissipation
1.25 W
Minimum DC Current Gain
100, 40
Transistor Configuration
Single
Maximum Collector Base Voltage
45 V
Maximum Emitter Base Voltage
5 V
Pin Count
3
Number of Elements per Chip
1
Dimensions
10.8 x 7.8 x 2.7mm
Maximum Operating Temperature
+150 °C
Country of Origin
Malaysia
Product details
General Purpose PNP Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.
BD 7.425
BD 0.148 Each (In a Tube of 50) (Exc. Vat)
BD 8.167
BD 0.163 Each (In a Tube of 50) (inc. VAT)
50
BD 7.425
BD 0.148 Each (In a Tube of 50) (Exc. Vat)
BD 8.167
BD 0.163 Each (In a Tube of 50) (inc. VAT)
50
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Tube |
|---|---|---|
| 50 - 200 | BD 0.148 | BD 7.425 |
| 250 - 450 | BD 0.143 | BD 7.150 |
| 500 - 1200 | BD 0.132 | BD 6.600 |
| 1250 - 2450 | BD 0.121 | BD 6.050 |
| 2500+ | BD 0.116 | BD 5.775 |
Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
PNP
Maximum DC Collector Current
-3 A
Maximum Collector Emitter Voltage
-45 V
Package Type
SOT-32
Mounting Type
Through Hole
Maximum Power Dissipation
1.25 W
Minimum DC Current Gain
100, 40
Transistor Configuration
Single
Maximum Collector Base Voltage
45 V
Maximum Emitter Base Voltage
5 V
Pin Count
3
Number of Elements per Chip
1
Dimensions
10.8 x 7.8 x 2.7mm
Maximum Operating Temperature
+150 °C
Country of Origin
Malaysia
Product details
General Purpose PNP Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.


