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Sunhayato Double Sided Matrix Board FR4 0.75mm Holes, 1.27 x 1.27mm Pitch, 160 x 115 x 1.6mm

RS Stock No.: 391-7175Brand: SunhayatoManufacturers Part No.: ICB-09
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Technical Document

Specifications

Number of Sides

2

Hole Pitch

1.27 x 1.27mm

Dimensions

160 x 115 x 1.6mm

Length

160mm

Width

115mm

Thickness

1.6mm

Base Material

Epoxy Glass Fabric Laminate

Hole Diameter

0.75mm

FR Material Grade

FR4

Country of Origin

Japan

Product details

Universal board for unique ICs

Supports combinations of 1.27, 1.27 houndstooth and 1.778 x 2.54
Suitable for installing ZIP ICs and multi-purpose use
Materials / thickness: glass epoxy (FR-4) 1.6 t
ICB-04 board thickness: 1.2 t

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.

Stock information temporarily unavailable.

BD 22.270

BD 22.270 Each (Exc. Vat)

BD 24.497

BD 24.497 Each (inc. VAT)

Sunhayato Double Sided Matrix Board FR4 0.75mm Holes, 1.27 x 1.27mm Pitch, 160 x 115 x 1.6mm

BD 22.270

BD 22.270 Each (Exc. Vat)

BD 24.497

BD 24.497 Each (inc. VAT)

Sunhayato Double Sided Matrix Board FR4 0.75mm Holes, 1.27 x 1.27mm Pitch, 160 x 115 x 1.6mm
Stock information temporarily unavailable.

Stock information temporarily unavailable.

Please check again later.

Technical Document

Specifications

Number of Sides

2

Hole Pitch

1.27 x 1.27mm

Dimensions

160 x 115 x 1.6mm

Length

160mm

Width

115mm

Thickness

1.6mm

Base Material

Epoxy Glass Fabric Laminate

Hole Diameter

0.75mm

FR Material Grade

FR4

Country of Origin

Japan

Product details

Universal board for unique ICs

Supports combinations of 1.27, 1.27 houndstooth and 1.778 x 2.54
Suitable for installing ZIP ICs and multi-purpose use
Materials / thickness: glass epoxy (FR-4) 1.6 t
ICB-04 board thickness: 1.2 t

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.