Technical Document
Specifications
Brand
TDKInductance
33 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
900mΩ
Maximum Self Resonant Frequency
1.8GHz
Minimum Quality Factor
8
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Country of Origin
Japan
Product details
Chip Inductor MLG1005S Series
High-frequency (multilayer) chip inductor
Monolithic structure combining ceramic and conductive materials
For use with mobile phones, portable networking devices and other high-frequency circuits
BD 0.385
BD 0.038 Each (In a Pack of 10) (Exc. Vat)
BD 0.423
BD 0.042 Each (In a Pack of 10) (inc. VAT)
10
BD 0.385
BD 0.038 Each (In a Pack of 10) (Exc. Vat)
BD 0.423
BD 0.042 Each (In a Pack of 10) (inc. VAT)
10
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | BD 0.038 | BD 0.385 |
| 100 - 240 | BD 0.033 | BD 0.330 |
| 250 - 490 | BD 0.028 | BD 0.275 |
| 500 - 990 | BD 0.028 | BD 0.275 |
| 1000+ | BD 0.022 | BD 0.220 |
Technical Document
Specifications
Brand
TDKInductance
33 nH
Maximum dc Current
300mA
Package/Case
0402 (1005M)
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
900mΩ
Maximum Self Resonant Frequency
1.8GHz
Minimum Quality Factor
8
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Country of Origin
Japan
Product details
Chip Inductor MLG1005S Series
High-frequency (multilayer) chip inductor
Monolithic structure combining ceramic and conductive materials
For use with mobile phones, portable networking devices and other high-frequency circuits


