Technical Document
Specifications
Brand
TDKPackage Type
0805 (2012M)
Impedance at 100 MHz
600Ω
Current Rating
500mA
Type
Chip Bead
Dimensions
2 x 1.25 x 0.85mm
Length
2mm
Depth
1.25mm
Maximum DC Resistance
0.35Ω
Height
0.85mm
Application
Signal Line
Series
MMZ
Material
S
Country of Origin
Japan
Product details
Chip bead 0805 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc
BD 44.000
BD 0.011 Each (On a Reel of 4000) (Exc. Vat)
BD 48.400
BD 0.012 Each (On a Reel of 4000) (inc. VAT)
4000
BD 44.000
BD 0.011 Each (On a Reel of 4000) (Exc. Vat)
BD 48.400
BD 0.012 Each (On a Reel of 4000) (inc. VAT)
4000
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Technical Document
Specifications
Brand
TDKPackage Type
0805 (2012M)
Impedance at 100 MHz
600Ω
Current Rating
500mA
Type
Chip Bead
Dimensions
2 x 1.25 x 0.85mm
Length
2mm
Depth
1.25mm
Maximum DC Resistance
0.35Ω
Height
0.85mm
Application
Signal Line
Series
MMZ
Material
S
Country of Origin
Japan
Product details
Chip bead 0805 MMZ series
This is a multilayered chip bead product which is magnetically shielded, allowing high density mounting
Reduced floating capacity between conductors has contributed to a dramatic improvement in high frequency characteristics
The EMI suppression provided extends into the GHz range
Application include removal of signal line noises of cellular phones, portable audio players, etc


