The Dexter Corporation 12mm, Brown
Technical Document
Specifications
Product details
Polyamide Hot Melt Glue
Excellent gap filling performance
Low temperature flexibility
Shock and heat resistance
Easy to apply and fast fixing
UL94V-0 Rating
Low Viscosity: Typical uses - wire staking, cable terminal encapsulation.
Hot melt polyamide adhesives, creamy-brown, for advanced electronic potting and assembly. Glue is applied in the Polyamide Glue Gun.
Low temperature flexibility and excellent impact resistance
Ideal where substrates may be exposed to temperature extremes
Elastomeric (elongation 900%)
Can also be used to bond PC board
Tough, flexible adhesive with excellent adhesion
Tensile strength, 600PSI
BD 17.726
BD 17.726 Each (Exc. Vat)
BD 19.499
BD 19.499 Each (inc. VAT)
1
BD 17.726
BD 17.726 Each (Exc. Vat)
BD 19.499
BD 19.499 Each (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price |
|---|---|
| 1 - 5 | BD 17.726 |
| 6 - 14 | BD 17.380 |
| 15+ | BD 17.144 |
Technical Document
Specifications
Product details
Polyamide Hot Melt Glue
Excellent gap filling performance
Low temperature flexibility
Shock and heat resistance
Easy to apply and fast fixing
UL94V-0 Rating
Low Viscosity: Typical uses - wire staking, cable terminal encapsulation.
Hot melt polyamide adhesives, creamy-brown, for advanced electronic potting and assembly. Glue is applied in the Polyamide Glue Gun.
Low temperature flexibility and excellent impact resistance
Ideal where substrates may be exposed to temperature extremes
Elastomeric (elongation 900%)
Can also be used to bond PC board
Tough, flexible adhesive with excellent adhesion
Tensile strength, 600PSI