Vero Technologies Matrix Board FR2 With 39 x 25 1.3mm Holes, 2.54 x 2.54mm Pitch, 104 x 65 x 1.6mm

RS Stock No.: 485-3909Brand: Vero TechnologiesManufacturers Part No.: 01-3937
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Technical Document

Specifications

Brand

Vero Technologies

Hole Pitch

2.54 x 2.54mm

Dimensions

104 x 65 x 1.6mm

Length

104mm

Width

65mm

Thickness

1.6mm

Base Material

Synthetic Resin Bonded Paper

Hole Diameter

1.3mm

FR Material Grade

FR2

Hole Layout

39 x 25

Country of Origin

United Kingdom

Product details

Matrix Boards

These SRBP panels are pierced on a 0.1 in. grid to accept press-fit single-sided and double-sided pins.
They provide a quick means of circuit ’breadboarding'

Stock information temporarily unavailable.

Please check again later.

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BD 1.690

Each (Exc. Vat)

BD 1.859

Each (Including VAT)

Vero Technologies Matrix Board FR2 With 39 x 25 1.3mm Holes, 2.54 x 2.54mm Pitch, 104 x 65 x 1.6mm

1

Available in multiples of 1
1BD 1.690
2BD 3.380
3BD 5.070
4BD 6.760
5BD 8.450
6BD 10.140
7BD 11.830
8BD 13.520
9BD 15.210
10BD 15.900
11BD 17.490
12BD 19.080
13BD 20.670
14BD 22.260
15BD 23.850

BD 1.690

Each (Exc. Vat)

BD 1.859

Each (Including VAT)

Vero Technologies Matrix Board FR2 With 39 x 25 1.3mm Holes, 2.54 x 2.54mm Pitch, 104 x 65 x 1.6mm
Stock information temporarily unavailable.

1

Available in multiples of 1
1BD 1.690
2BD 3.380
3BD 5.070
4BD 6.760
5BD 8.450
6BD 10.140
7BD 11.830
8BD 13.520
9BD 15.210
10BD 15.900
11BD 17.490
12BD 19.080
13BD 20.670
14BD 22.260
15BD 23.850

Buy in bulk

quantityUnit price
1 - 9BD 1.690
10 - 19BD 1.590
20 - 49BD 1.505
50+BD 1.435

Technical Document

Specifications

Brand

Vero Technologies

Hole Pitch

2.54 x 2.54mm

Dimensions

104 x 65 x 1.6mm

Length

104mm

Width

65mm

Thickness

1.6mm

Base Material

Synthetic Resin Bonded Paper

Hole Diameter

1.3mm

FR Material Grade

FR2

Hole Layout

39 x 25

Country of Origin

United Kingdom

Product details

Matrix Boards

These SRBP panels are pierced on a 0.1 in. grid to accept press-fit single-sided and double-sided pins.
They provide a quick means of circuit ’breadboarding'