Vero Technologies FR4 1.02 mm Holes, 2.54 mm Pitch
Technical Document
Specifications
Brand
Vero TechnologiesHole Pitch
2.54mm
Board Thickness
1.6mm
Board Material
Epoxy Glass Fabric Laminate
Hole Diameter
1.02mm
FR Material Grade
FR4
Country of Origin
United Kingdom
Product details
Square Pad PCB
Recommended for wire-wrapping applications
Epoxy glass - CEM 30
1.6mm thick, copper-clad
Single sided
Hole pitch 2.54mm (0.1in)
Hole dia 1.0mm
DIN Type Matrixboard
Matrix boards with 1mm holes on a 2.50mm pitch.
BD 33.214
Each (Exc. Vat)
Stock information temporarily unavailable.
BD 30.807
BD 30.807 Each (Exc. Vat)
BD 33.888
BD 33.888 Each (inc. VAT)
1
BD 30.807
BD 30.807 Each (Exc. Vat)
BD 33.888
BD 33.888 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 4 | BD 30.807 |
| 5 - 9 | BD 29.258 |
| 10 - 39 | BD 27.732 |
| 40+ | BD 26.189 |
BD 33.214
Each (Exc. Vat)
Technical Document
Specifications
Brand
Vero TechnologiesHole Pitch
2.54mm
Board Thickness
1.6mm
Board Material
Epoxy Glass Fabric Laminate
Hole Diameter
1.02mm
FR Material Grade
FR4
Country of Origin
United Kingdom
Product details
Square Pad PCB
Recommended for wire-wrapping applications
Epoxy glass - CEM 30
1.6mm thick, copper-clad
Single sided
Hole pitch 2.54mm (0.1in)
Hole dia 1.0mm
DIN Type Matrixboard
Matrix boards with 1mm holes on a 2.50mm pitch.
BD 33.214
Each (Exc. Vat)