Vishay 100μF Surface Mount Polymer Capacitor, 6.3V dc

RS Stock No.: 173-0486Brand: VishayManufacturers Part No.: T55B107M6R3C0035
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Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

100µF

Voltage

6.3V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

3528-21

Equivalent Series Resistance

35mΩ

Tolerance

±20%

Length

3.5mm

Depth

2.8mm

Maximum Operating Temperature

+105°C

Height

1.9mm

Dimensions

3.5 x 2.8 x 1.9mm

Series

T55

Electrolyte Type

Solid

Minimum Operating Temperature

-55°C

Leakage Current

63 μA

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets

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BD 0.185

Each (On a Reel of 2000) (Exc. Vat)

BD 0.203

Each (On a Reel of 2000) (Including VAT)

Vishay 100μF Surface Mount Polymer Capacitor, 6.3V dc

BD 0.185

Each (On a Reel of 2000) (Exc. Vat)

BD 0.203

Each (On a Reel of 2000) (Including VAT)

Vishay 100μF Surface Mount Polymer Capacitor, 6.3V dc
Stock information temporarily unavailable.

Technical Document

Specifications

Brand

Vishay

Technology

Polymer

Capacitance

100µF

Voltage

6.3V dc

Dielectric Material Family

Tantalum

Mounting Type

Surface Mount

Package/Case

3528-21

Equivalent Series Resistance

35mΩ

Tolerance

±20%

Length

3.5mm

Depth

2.8mm

Maximum Operating Temperature

+105°C

Height

1.9mm

Dimensions

3.5 x 2.8 x 1.9mm

Series

T55

Electrolyte Type

Solid

Minimum Operating Temperature

-55°C

Leakage Current

63 μA

Product details

T55 Series

T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type

Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets