Technical Document
Specifications
Brand
WinbondMemory Size
2Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Words
256M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
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BD 2.915
Each (In a Pack of 2) (Exc. Vat)
BD 3.207
Each (In a Pack of 2) (Including VAT)
2
BD 2.915
Each (In a Pack of 2) (Exc. Vat)
BD 3.207
Each (In a Pack of 2) (Including VAT)
2
Buy in bulk
quantity | Unit price | Per Pack |
---|---|---|
2 - 8 | BD 2.915 | BD 5.830 |
10 - 18 | BD 2.475 | BD 4.950 |
20 - 98 | BD 2.435 | BD 4.870 |
100 - 198 | BD 2.220 | BD 4.440 |
200+ | BD 2.210 | BD 4.420 |
Technical Document
Specifications
Brand
WinbondMemory Size
2Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Words
256M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C