Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.1 x 6.1 x 0.85mm
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
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BD 1.490
Each (In a Pack of 5) (Exc. Vat)
BD 1.639
Each (In a Pack of 5) (Including VAT)
5
BD 1.490
Each (In a Pack of 5) (Exc. Vat)
BD 1.639
Each (In a Pack of 5) (Including VAT)
5
Buy in bulk
quantity | Unit price | Per Pack |
---|---|---|
5 - 5 | BD 1.490 | BD 7.450 |
10+ | BD 1.250 | BD 6.250 |
Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.1 x 6.1 x 0.85mm
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C