Technical Document
Specifications
Brand
WinbondMemory Size
2GB
Product Type
Flash Memory
Interface Type
Parallel
Package Type
VFBGA
Pin Count
63
Organisation
256M x 8 Bit
Mount Type
Surface
Cell Type
SLC NAND
Minimum Supply Voltage
2.7V
Maximum Supply Voltage
3.6V
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Height
0.6mm
Length
11.1mm
Width
9.1 mm
Standards/Approvals
No
Automotive Standard
No
Number of Words
256M
Number of Bits per Word
8
Supply Current
35mA
Maximum Random Access Time
25μs
Series
W29N02GV
Country of Origin
Taiwan, Province Of China
Stock information temporarily unavailable.
P.O.A.
Each (Supplied in a Tray) (Exc. Vat)
Production pack (Tray)
2
P.O.A.
Each (Supplied in a Tray) (Exc. Vat)
Stock information temporarily unavailable.
Production pack (Tray)
2
Technical Document
Specifications
Brand
WinbondMemory Size
2GB
Product Type
Flash Memory
Interface Type
Parallel
Package Type
VFBGA
Pin Count
63
Organisation
256M x 8 Bit
Mount Type
Surface
Cell Type
SLC NAND
Minimum Supply Voltage
2.7V
Maximum Supply Voltage
3.6V
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Height
0.6mm
Length
11.1mm
Width
9.1 mm
Standards/Approvals
No
Automotive Standard
No
Number of Words
256M
Number of Bits per Word
8
Supply Current
35mA
Maximum Random Access Time
25μs
Series
W29N02GV
Country of Origin
Taiwan, Province Of China


