331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

RS Stock No.: 773-4277Brand: Wurth ElektronikManufacturers Part No.: 331171302030
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Technical Document

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability

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BD 0.415

Each (In a Bag of 5) (Exc. Vat)

BD 0.457

Each (In a Bag of 5) (Including VAT)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm

BD 0.415

Each (In a Bag of 5) (Exc. Vat)

BD 0.457

Each (In a Bag of 5) (Including VAT)

331171302030, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 3.15mm x 2mm x 3mm
Stock information temporarily unavailable.

Buy in bulk

quantityUnit pricePer Bag
5 - 20BD 0.415BD 2.075
25 - 45BD 0.400BD 2.000
50 - 95BD 0.370BD 1.850
100 - 245BD 0.350BD 1.750
250+BD 0.315BD 1.575

Technical Document

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

3mm

Length

3.15mm

Width_SC_PC

2mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability