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Fischer Elektronik Heatsink, Universal Rectangular Alu with fan, 0.13K/W, 150 x 92 x 93mm

RS Stock No.: 692-0607Brand: Fischer ElektronikManufacturers Part No.: LA 21 150 24 V
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Technical Document

Specifications

For Use With

Universal Rectangular Alu with fan

Length

150mm

Width

92mm

Height

93mm

Dimensions

150 x 92 x 93mm

Thermal Resistance

0.13K/W

Material

Aluminium

Country of Origin

Hungary

Product details

Fischer Elektronik Cooling Aggregates with Axial Fans

Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal.

Geometry of optimising the airflow
Particularly effective heat dissipation
Compact construction
Milled flat semiconductor mounting surface

You may be interested in

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BD 122.170

BD 122.170 Each (Exc. Vat)

BD 134.387

BD 134.387 Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Rectangular Alu with fan, 0.13K/W, 150 x 92 x 93mm

BD 122.170

BD 122.170 Each (Exc. Vat)

BD 134.387

BD 134.387 Each (inc. VAT)

Fischer Elektronik Heatsink, Universal Rectangular Alu with fan, 0.13K/W, 150 x 92 x 93mm
Stock information temporarily unavailable.

Buy in bulk

quantityUnit price
1 - 1BD 122.170
2 - 4BD 120.485
5 - 9BD 119.860
10+BD 117.975
You may be interested in

Technical Document

Specifications

For Use With

Universal Rectangular Alu with fan

Length

150mm

Width

92mm

Height

93mm

Dimensions

150 x 92 x 93mm

Thermal Resistance

0.13K/W

Material

Aluminium

Country of Origin

Hungary

Product details

Fischer Elektronik Cooling Aggregates with Axial Fans

Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal.

Geometry of optimising the airflow
Particularly effective heat dissipation
Compact construction
Milled flat semiconductor mounting surface

You may be interested in