Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
BD 14.148
BD 14.148 Each (Exc. Vat)
BD 15.563
BD 15.563 Each (inc. VAT)
1
BD 14.148
BD 14.148 Each (Exc. Vat)
BD 15.563
BD 15.563 Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 4 | BD 14.148 |
| 5 - 9 | BD 13.583 |
| 10 - 39 | BD 13.080 |
| 40+ | BD 12.142 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
