Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
BD 19.201
BD 19.201 1 Bag of 10 (Exc. Vat)
BD 21.121
BD 21.121 1 Bag of 10 (inc. VAT)
1
BD 19.201
BD 19.201 1 Bag of 10 (Exc. Vat)
BD 21.121
BD 21.121 1 Bag of 10 (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | BD 19.201 |
| 10 - 19 | BD 18.427 |
| 20 - 49 | BD 17.854 |
| 50+ | BD 16.612 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
