Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
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BD 15.840
1 Bag of 10 (Exc. Vat)
BD 17.424
1 Bag of 10 (Including VAT)
1
BD 15.840
1 Bag of 10 (Exc. Vat)
BD 17.424
1 Bag of 10 (Including VAT)
1
Buy in bulk
quantity | Unit price |
---|---|
1 - 9 | BD 15.840 |
10 - 19 | BD 15.205 |
20 - 49 | BD 14.730 |
50+ | BD 13.545 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips