Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
BD 13.772
BD 13.772 Each (Exc. Vat)
BD 15.149
BD 15.149 Each (inc. VAT)
1
BD 13.772
BD 13.772 Each (Exc. Vat)
BD 15.149
BD 15.149 Each (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price |
|---|---|
| 1 - 4 | BD 13.772 |
| 5 - 9 | BD 13.304 |
| 10 - 39 | BD 12.815 |
| 40+ | BD 11.902 |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
